doc. no : qw0905-la38b-78/h-pf rev. : a date : - 2007 23- may data sheet ligitek electronics co.,ltd. property of ligitek only led array la38b-78/h-pf lead-free parts pb
2.54typ 0.5 typ lh2040-pf note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 25.0min 2.54typ 1.0min + - 0.5 typ 4.0 3.0 5.2 4.2 1.5max - + package dimensions la38b-78/h-pf part no. page1/5 7.0 3.5 0.5 4.0 4.2 5.2 3.0 4.0 ligitek electronics co.,ltd. property of ligitek only 12.2 0.5
-40 ~ +100 tstg storage temperature forward voltage @20ma(v) luminous intensity @10ma(mcd) spectral halfwidth nm viewing angle 2 1/2 (deg) material peak wave length pnm part no note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. gap la38b-78/h-pf 4.5 typ. 697 redred diffused3.0 2.6 1.7 90 emittedlensmin.max.min. 36 typical electrical & optical characteristics (ta=25 ) color page 2/5 reverse current @5v operating temperature peak forward current duty 1/10@10khz absolute maximum ratings at ta=25 forward current power dissipation parameter 15 ma i f t opr ir -40 ~ +85 10 pd i fp 40 60 a ma mw symbol h ratings unit ligitek electronics co.,ltd. property of ligitek only part no. la38b-78/h-pf
1.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 ambient temperature( ) 1000 900 800 700 600 wavelength (nm) fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a 0.0 0.5 1.0 0.8 -40 0.9 -20020406080100-40 0.0 1.0 0.5 -20 80 40 20 060100 ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current forward current(ma) fig.4 relative intensity vs. temperature forward voltage(v) fig.3 forward voltage vs. temperature 1.1 1.0 1.2 f o r w a r d c u r r e n t ( m a ) 0.1 1.0 1.0 100 10 1000 2.03.0 2.0 3.0 2.5 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 4.05.01.0 0.0 0.5 1.0 2.0 1.5 3.0 2.5 typical electro-optical characteristics curve fig.1 forward current vs. forward voltage h chip 101001000 page3/5 part no. la38b-78/h-pf
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) 60 seconds max 25 0 0 2 /sec max preheat 50 time(sec) 100 150 260 c3sec max 120 260 temp( c) 5 /sec max soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to case) 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only page 4/5 part no. la38b-78/h-pf note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above.
mil-std-202:103b jis c 7021: b-11 the purpose of this test is the resistance of the device under tropical for hours. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs high temperature high humidity test the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=230 5 2.dwell time=5 1sec solderability test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test thermal shock test mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 ligitek electronics co.,ltd. property of ligitek only description the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. reliability test: 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature storage test operating life test test itemtest condition mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 reference standard page 5/5 part no. la38b-78/h-pf
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